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 AOS Semiconductor Product Reliability Report
AOZ8000CI, rev 2
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com Mar 27, 2007
1
This AOS product reliability report summarizes the qualification result for AOZ8000CI. Review of the electrical test results confirm that AOZ8000CI pass AOS quality and reliability requirements for product release. The continuous qualification testing and reliability monitoring program ensure that all outgoing products will continue to meet AOS quality and reliability standards.
Table of Contents:
I. II. III. IV. V. VI. Product Description Package and Die information Qualification Test Requirements Qualification Tests Result Reliability Evaluation Quality Assurance Information
I. Product Description:
The AOZ8000CI is a transient voltage suppressor array designed to protect high speed data lines from ESD and lightning. The product comes in RoHS compliant, SOT-23 package and is rated over a -40C to +85C ambient temperature range. . Absolute Maximum Ratings Parameter VP-VN 6V Peak Pulse Current (Ipp), tp=8/20uS 5A Storage Temperature (TS) -65C to +150C ESD Rating per IEC61000-4-2, contact (1) 12kV ESD Rating per IEC61000-4-2, air (2) 15kV ESD Rating per Human Body Model (2) 15kV Junction Temperature (Tj) -40C to +125C
Notes:
(1) IEC-61000-4-2 discharge with CDischarge=150pF, RDischarge=330 (2) Human Body Discharge per MIL-STD-883, Method 3015 CDischarge=100pF, RDischarge=1.5k
II. Package and Die Information:
Product ID Process Package Type Die L/F material Die attach material Die bond wire Mold Material Plating Material AOZ8000CI UMC 0.5um 5/18V 2P3M process SOT-23
UE003A3 (size: 716 x 616 um) Copper A194FH 84-3J epoxy Au, 1mil MP8000CH4 Pure Tin
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III. Qualification Tests Requirments
* * 2 lots of AOZ8000CI up to 168 hrs of B/I for New Product release. 2 lots of package qual testing (PCT, 250 cycles TC) for SOT-23 for package release to manufacturing.
IV. Qualification Tests Result
Test Item PreConditioning Test Condition
Per JESD 22-A113 0 85 C /85%RH, 3 cyc 0 reflow@260 C Per JESD 22-A108_B Vdd=6V Temp = 125 0C Per JESD 22-A108_B Vdd=6V Temp = 125 0C '130 +/- 2 0C, 85%RH, 33.3 psi, at VCC min power dissapation.
Sample Size
2 lots (82 /lot)
Result
pass
Comment
Lot 1 (wafer lot# FN2MT.54, marking: AB002), 82 units, passed pre-conditioning. Lot 2 (wafer lot# FN2MT.54, marking: AB003), 82 units, passed pre-conditioning. Lot 1 (wafer lot# F9AN1.51, wafer# 4, marking: AB001), 80 units, passed 168 hrs . Lot 2 (wafer lot# FN2MT.54, wafer# 18, marking: AB003), 80 units, passed 168 hrs . Lot 1 (wafer lot# FNG88-2/3, marking: AC001), 80 units, passed 500 hrs . Lot 2 (wafer lot# FAYY3.02-3 marking: AB008), 80 units, passed 168 hrs . Lot 1 (wafer lot# FN2MT.54, marking: AB002), 60 units, passed HAST 100 hrs. Lot 2 (wafer lot# FN2MT.54, marking: AB003), 60 units, passed HAST 100 hrs. Lot 1 (wafer lot# FN2MT.54, marking: AB002), 82 units, passed TC 500 cycles. Lot 2 (wafer lot# FN2MT.54, marking: AB003), 82 units, passed TC 500 cycles. Lot 1 (wafer lot# FN2MT.54, marking: AB002), 82 units, passed PCT 96 hrs. Lot 2 (wafer lot# FN2MT.54, marking: AB003), 82 units, passed PCT 96 hrs. Lot 1 (wafer lot# F9AN1.51, assembly marking: Z96R11), 20 units passed 12kV Lot 2 (wafer lot# F162T, assembly marking: B1001), 10 units passed 12kV Lot 1 (wafer lot# F9AN1.51, assembly marking: Z96R11), 20 units passed 15kV Lot 1 (wafer lot# F162T, assembly marking: B1001), 3 units passed Latch-up.
HTOL (old UE003A process) HTOL (new UH_EPI process) HAST
2 lots (80 /lot)
pass
2 lots (80 /lot)
pass
2 lots (60 /lot)
pass
Temperature Cycle
'-65 0C to +150 0C, air to air (2cyc/hr)
2 lots (82 /lot)
pass
Pressure Pot
121C, 15+/-1 PSIG, RH= 100%
2 lots (82 /lot)
pass
ESD Rating
Per IEC-61000-4-2, contact
30 units
pass
ESD Rating Latch-up
Per IEC-61000-4-2, air Per JESD78A
20 units 3 units
pass pass
The qualification test results confirm that AOZ8000CI pass AOS quality and reliability requirements for product release.
3
V. Reliability Evaluation A. Failure Rate Prediction FIT rate (per billion): see note 1 MTBF = see note 1
The presentation of FIT rate for the individual product reliability is restricted by the limited burn-in sample size of AOZ8000CI. The calculation will be presented (using the method discussed below) on the final qualification report when more data are available.
1
AOS uses industry standard techniques (JEDEC Standard JESD 85) for failure rate prediction by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation. FIT means one failure per billion hours. The failure rate and MTBF are calculated as follows: AF = exp{(Ea/k) x [1/T0-1/Ts]} Looking up the 2 /2 table (see above) for zero failure (see HTOL result above) with 60% confidence, the value of (2[CL,(2f+2)] /2) is 0.92. Failure Rate = Chi2 [CL, (2f+2)] x 109 / [2 (ss) (t) (AF)] 9 MTBF = 10 / FIT Chi (2)= Chi Squared Distribution, determined by the number of failures and confidence interval ss = Total Number of units from HTOL testing t = Duration of HTOL testing AF = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55C) Acceleration Factor [AF] = exp [Ea / k (1/Tj u - 1/Tj s)] Tj s = Stressed junction temperature in degree (Kelvin), K = C+273 Tj u = Used junction temperature in degree (Kelvin), K = C+273 k = Boltznan's constant, 8.617x10-5 V / K
B. Package Qualification Testing
Package qual. testing are performed (see section IV) to ensure the product meet AOS quality and reliability standards.
VI. Quality Assurance Information
Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 50 ppm Quality Sample Plan: conform to Mil-Std -105D
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